About the Role
Type of employment：
Full Time
Job Title：
Advanced Packaging Engineer - Technology Development
Number of Vacancies：
1
Job Function：
Research & Development
Description：
Technology Development
Job Description：
At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose.
With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments.
With us, you can expect at UMC:
• Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain times
• Growth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobility
• Meaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation
Main Responsibilities
As a Senior Technology Development Engineer (Advanced Packaging), you will:
• Drive R&D and process integration for 2.5D and 3DIC packaging platforms.
• Lead the development and qualification of new unit modules and device structures.
• Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms.
• Collaborate directly with customers on product requirements, verification testing, and technical solutions.
• Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.
Location：
Singapore
Site：
Pasir Ris
Management Responsibility：
Non- managerial
Business travel：
None
Working Hours：
Mon – Thurs 8.30am – 6.00pm, Friday 8.30am – 5.30pm
Shift Pattern：
Shift work required
Leave entitlement：
Work five-days week
Date available：
Any time
Job Requirement
Years of Experience：
Fresh Graduate
Education：
At least a bachelor's degree
Major：
Engineering
Other requirement：
You are someone who brings precision, resilience, and purpose to everything you do. You thrive in a collaborative, tech-forward environment and are ready to lead work that drives impact and transformation.
We’re looking for someone with:
• A bachelor’s degree or higher in Microelectronics, Electrical Engineering, Physics, Materials Engineering, or a related field.
• At least 7 years of experience in semiconductor R&D, process integration, or device engineering in a foundry is preferred.
• Experience with advanced packaging platforms, including 2.5D and 3DIC technologies is a strong plus.
• Proficiency in semiconductor device physics, integration methodologies, and device characterization.
• Expertise in DOE, control planning, and FMEA for process and quality optimization.
• Strong communication skills with the ability to collaborate effectively across functions.
• A self-motivated, data-driven mindset with a passion for technology innovation.
Ready to Precision-Engineer Your Future?
Whether you're seeking your next challenge or ready to lead meaningful innovation, UMC is where you can shape what comes next.
Lead What’s Next. Apply Now.
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