At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose.

With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments.

With us, you can expect at UMC:

• Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain times

• Growth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobility

• Meaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation Main Responsibilities As a Senior Technology Development Engineer (Advanced Packaging), you will:

• Drive R&D and process integration for 2.5D and 3DIC packaging platforms.

• Lead the development and qualification of new unit modules and device structures.

• Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms

• Collaborate directly with customers on product requirements, verification testing, and technical solutions.

• Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks..

You are someone who brings precision, resilience, and purpose to everything you do. You thrive in a collaborative, tech-forward environment and are ready to lead work that drives impact and transformation. We’re looking for someone with:

• A bachelor’s degree or higher in Microelectronics, Electrical Engineering, Physics, Materials Engineering, or a related field.

• At least 7 years of experience in semiconductor R&D, process integration, or device engineering in a foundry is preferred.

• Experience with advanced packaging platforms, including 2.5D and 3DIC technologies is a strong plus.

• Proficiency in semiconductor device physics, integration methodologies, and device characterization.

• Expertise in DOE, control planning, and FMEA for process and quality optimization.

• Strong communication skills with the ability to collaborate effectively across functions.

• A self-motivated, data-driven mindset with a passion for technology innovation. Ready to Precision-Engineer Your Future? Whether you're seeking your next challenge or ready to lead meaningful innovation, UMC is where you can shape what comes next. Lead What’s Next. Apply Now.